Tasks/nodebook/2025.06-19.md

中文

## 新完成

## 进行中
  - 1. 所有设备相机参数标准化
    进展：仅剩DieBond贴片相机待确认。

  - 2. DieBond设备照明优化
    - I. 定制组合光源：同轴光+环形光
    - II. 采购更窄、更亮的侧面光源，以解决支架白边问题
    进展：配置已与供应商确认，预计2025年7月4日发货。

  - 3. DieBond和ClipBond软件界面中英文翻译更新（SG-TATA）
    进展：SG-TATA GUI 的中英文翻译已完成。未来更新杨杰的代码后，需要重新进行翻译（任务量很少）。

## 下一步计划
  - 1. 所有设备相机手册（校准、位置引导、检测）
  - 2. 开发 TaTa SECS/GEM & Map 软件。
  - 3. 跟进 TaTa 软件授权：
    - I. Halcon
    - II. CIMConnect RT
    - III. CIMConnect CIM142
    - IV. Visual Studio 2019
    - V. Microsoft .NET Runtime（免费）
  - 4. 完成 TaTa SECS/GEM 通讯手册，用于支持客户集成机器的 SECS/GEM 功能。

  - 5. 扫码枪是否需要添加: 用于获取 Wafer 和 Strip 的序列号（涉及 SECS/GEM 相关内容）。
  - 6. 日志文件优化：: 为 LogFile 添加翻译（当前日志文件为中文），格式如下：日期：中文＋英文
  - 7. 光源优化（ClipBond 点胶相机）: 添加侧灯，以进一步优化芯片上胶点的检测图像效果。
  - 8. 光源优化（ClipBond 向下看相机）:  添加侧灯。
  - 9. 光源优化（DieBond Pick Camera）: 添加侧灯。当前使用的光源为手工焊接的环光。需要找灵猴定制标准化侧灯（非紧急事项）。

英文

## Newly Completed
 
## Work In Progress
  - 1. All Machines Camera parameter standardization
    Progress: Only DieBond Place camera remains to be confirmed.

  - 2. DieBond machine lighting optimization (DieBond Place Camera)
    - I. Custom combination light source: coaxial light + ring light
    - II. Purchase narrower and brighter side lighting to solve the white edge problem of the frame
    Progress: Configuration has been confirmed with the supplier, expected delivery on July 7, 2025.

  - 3. DieBond and ClipBond Software GUI Chinese-English translation update (SG-TATA)
    Progress: The Chinese and English translations for the SG-TATA GUI have been completed. After updating to Yang Jie's code in the future, the translations will need to be redone (little workload).
 
## Next To Do
  - 1. All Machines Camera Manual (Calibration, Position Guidance, Inspection)
  - 2. Develop TaTa SECS/GEM & Map software.
  - 3. Follow up on TaTa software licensing:
    - I. Halcon
    - II. CIMConnect RT
    - III. CIMConnect CIM142
    - IV. Visual Studio 2019
    - V. Microsoft .NET Runtime (free)
  - 4. Complete TaTa SECS/GEM communication manual to support customers in integrating machine SECS/GEM functionality.

  - 5. Whether to add barcode scanner: for obtaining Wafer and Strip serial numbers (related to SECS/GEM content).
  - 6. Log file optimization: Add translation for LogFile (current log files are in Chinese), format as follows: Date: Chinese + English
  - 7. Lighting optimization (ClipBond dispensing camera): Add side lighting to further optimize chip adhesive point detection image quality.
  - 8. Lighting optimization (ClipBond downward-looking camera): Add side lighting.
  - 9. Lighting optimization (DieBond Pick Camera): Add side lighting. Currently using manually welded ring light. Need to find Linghou to customize standardized side lighting (non-urgent task).