72 lines
3.4 KiB
Markdown
72 lines
3.4 KiB
Markdown
## 中文
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```yaml
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## 新完成
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## 进行中
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- 1. 所有设备相机参数标准化
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进展：仅剩DieBond贴片相机待确认。
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- 2. DieBond设备照明优化
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- I. 定制组合光源：同轴光+环形光
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- II. 采购更窄、更亮的侧面光源，以解决支架白边问题
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进展：配置已与供应商确认，预计2025年7月4日发货。
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- 3. DieBond和ClipBond软件界面中英文翻译更新（SG-TATA）
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进展：SG-TATA GUI 的中英文翻译已完成。未来更新杨杰的代码后，需要重新进行翻译（任务量很少）。
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## 下一步计划
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- 1. 所有设备相机手册（校准、位置引导、检测）
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- 2. 开发 TaTa SECS/GEM & Map 软件。
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- 3. 跟进 TaTa 软件授权：
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- I. Halcon
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- II. CIMConnect RT
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- III. CIMConnect CIM142
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- IV. Visual Studio 2019
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- V. Microsoft .NET Runtime（免费）
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- 4. 完成 TaTa SECS/GEM 通讯手册，用于支持客户集成机器的 SECS/GEM 功能。
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- 5. 扫码枪是否需要添加: 用于获取 Wafer 和 Strip 的序列号（涉及 SECS/GEM 相关内容）。
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- 6. 日志文件优化：: 为 LogFile 添加翻译（当前日志文件为中文），格式如下：日期：中文＋英文
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- 7. 光源优化（ClipBond 点胶相机）: 添加侧灯，以进一步优化芯片上胶点的检测图像效果。
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- 8. 光源优化（ClipBond 向下看相机）: 添加侧灯。
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- 9. 光源优化（DieBond Pick Camera）: 添加侧灯。当前使用的光源为手工焊接的环光。需要找灵猴定制标准化侧灯（非紧急事项）。
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```
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## 英文
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```yaml
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## Newly Completed
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## Work In Progress
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- 1. All Machines Camera parameter standardization
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Progress: Only DieBond Place camera remains to be confirmed.
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- 2. DieBond machine lighting optimization (DieBond Place Camera)
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- I. Custom combination light source: coaxial light + ring light
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- II. Purchase narrower and brighter side lighting to solve the white edge problem of the frame
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Progress: Configuration has been confirmed with the supplier, expected delivery on July 7, 2025.
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- 3. DieBond and ClipBond Software GUI Chinese-English translation update (SG-TATA)
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Progress: The Chinese and English translations for the SG-TATA GUI have been completed. After updating to Yang Jie's code in the future, the translations will need to be redone (little workload).
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## Next To Do
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- 1. All Machines Camera Manual (Calibration, Position Guidance, Inspection)
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- 2. Develop TaTa SECS/GEM & Map software.
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- 3. Follow up on TaTa software licensing:
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- I. Halcon
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- II. CIMConnect RT
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- III. CIMConnect CIM142
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- IV. Visual Studio 2019
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- V. Microsoft .NET Runtime (free)
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- 4. Complete TaTa SECS/GEM communication manual to support customers in integrating machine SECS/GEM functionality.
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- 5. Whether to add barcode scanner: for obtaining Wafer and Strip serial numbers (related to SECS/GEM content).
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- 6. Log file optimization: Add translation for LogFile (current log files are in Chinese), format as follows: Date: Chinese + English
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- 7. Lighting optimization (ClipBond dispensing camera): Add side lighting to further optimize chip adhesive point detection image quality.
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- 8. Lighting optimization (ClipBond downward-looking camera): Add side lighting.
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- 9. Lighting optimization (DieBond Pick Camera): Add side lighting. Currently using manually welded ring light. Need to find Linghou to customize standardized side lighting (non-urgent task).
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```
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